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d a t a sh eet product speci?cation supersedes data of 2001 aug 24 2004 jan 28 integrated circuits tda1519c 22 w btl or 2 11 w stereo power amplifier
2004 jan 28 2 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c features requires very few external components for bridge-tied load (btl) operation stereo or btl application high output power low offset voltage at output (important for btl applications) fixed gain good ripple rejection mute/standby switch load dump protection ac and dc short-circuit safe to ground and v p thermally protected reverse polarity safe capability to handle high energy on outputs (v p =0v) no switch-on/switch-off plops protected against electrostatic discharge low thermal resistance identical inputs (inverting and non-inverting) pin compatible with tda1519b (tda1519c and tda1519csp). general description the tda1519c is an integrated class-b dual output amplifier in a 9-lead plastic single in-line power package or 20-lead heatsink small outline package. for the tda1519cth (sot418-3), the heatsink is positioned on top of the package, which allows an external heatsink to be mounted on top. the heatsink of the tda1519ctd (sot397-1) is facing the pcb, allowing the heatsink to be soldered onto the copper area of the pcb. ordering information type number package name description version tda1519c sil9p plastic single in-line power package; 9 leads sot131-2 tda1519csp sms9p plastic surface mounted single in-line power package; 9 leads sot354-1 tda1519ctd hsop20 plastic, heatsink small outline package; 20 leads sot397-1 tda1519cth hsop20 plastic, heatsink small outline package; 20 leads; low stand-off height sot418-3
2004 jan 28 3 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c quick reference data symbol parameter conditions min. typ. max. unit supply v p supply voltage operating 6.0 14.4 17.5 v non-operating -- 30 v load dump protected -- 45 v i orm repetitive peak output current -- 4a i q(tot) total quiescent current - 40 80 ma i stb standby current - 0.1 100 m a i sw(on) switch-on current -- 40 m a inputs ? z i ? input impedance btl 25 -- k w stereo 50 -- k w stereo application p o output power thd = 10 % r l =4 w- 6 - w r l =2 w- 11 - w a cs channel separation 40 -- db v n(o)(rms) noise output voltage (rms value) - 150 -m v btl application p o output power thd = 10 %; r l =4 w- 22 - w svrr supply voltage ripple rejection r s =0 w f i = 100 hz 34 -- db f i = 1 to 10 khz 48 -- db ?d v oo ? dc output offset voltage -- 250 mv t j junction temperature -- 150 c
2004 jan 28 4 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c block diagram fig.1 block diagram. mgl491 handbook, full pagewidth 60 k w input reference voltage power ground (substrate) + + - 5 signal ground 2 7 9 6 183 w 18.1 k w 3 tda1519c tda1519csp 15 k w 15 k w va va c m mute switch power stage 60 k w standby reference voltage mute reference voltage 1 ninv rr inv out2 m/ss out1 gnd1 gnd2 v p 4 8 183 w 18.1 k w va c m mute switch power stage + - mute switch standby switch 1 v p the pin numbers refer to the tda1519c and tda1519csp only, for tda1519ctd and tda1519cth see figs 3 and 4.
2004 jan 28 5 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c pinning symbol pin description tda1519c; tda1519csp tda1519ctd tda1519cth ninv 1 19 19 non-inverting input gnd1 2 20 20 ground 1 (signal) rr 3 1 1 supply voltage ripple rejection out1 4 3 3 output 1 gnd2 5 5 5 ground 2 (substrate) out2 6 8 8 output 2 v p 7 10 10 positive supply voltage m/ss 8 11 11 mute/standby switch input inv 9 12 12 inverting input n.c. - 2, 4, 6, 7, 9 and 13 to 18 2, 4, 6, 7, 9 and 13 to 18 not connected fig.2 pin configuration tda1519c and tda1519csp. h alfpage ninv gnd1 rr out1 gnd2 out2 v p m/ss inv 1 2 3 4 5 6 7 8 9 tda1519c tda1519csp mgr561 f page rr n.c. out1 n.c. gnd2 n.c. n.c. out2 n.c. v p gnd1 ninv n.c. n.c. n.c. n.c. n.c. n.c. inv m/ss 1 2 3 4 5 6 7 8 9 10 11 12 20 19 18 17 16 15 14 13 tda1519ctd mgl937 fig.3 pin configuration tda1519ctd. tda1519cth gnd1 rr ninv n.c. n.c. out1 n.c. n.c. n.c. gnd2 n.c. n.c. n.c. n.c. n.c. out2 inv n.c. m/ss v p 001aaa348 20 19 18 17 16 15 14 13 12 11 9 10 7 8 5 6 3 4 1 2 fig.4 pin configuration tda1519cth.
2004 jan 28 6 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c functional description the tda1519c contains two identical amplifiers with differential input stages. the gain of each amplifier is fixed at 40 db. a special feature of this device is the mute/standby switch which has the following features: low standby current (<100 m a) low mute/standby switching current (allows for low-cost supply switch) mute condition. limiting values in accordance with the absolute maximum rating system (iec 60134). symbol parameter conditions min. max. unit v p supply voltage operating - 17.5 v non-operating - 30 v load dump protected; during 50 ms; t r 3 2.5 ms - 45 v v sc ac and dc short-circuit-safe voltage - 17.5 v v rp reverse polarity voltage - 6v e o energy handling capability at outputs v p =0v - 200 mj i osm non-repetitive peak output current - 6a i orm repetitive peak output current - 4a p tot total power dissipation see fig.5 - 25 w t j junction temperature - 150 c t stg storage temperature - 55 +150 c fig.5 power derating curve for tda1519c. handbook, halfpage - 25 0 50 150 30 10 0 20 mgl492 100 p tot (w) t amb ( c) (1) (2) (3) (1) infinite heatsink. (2) r th(c-a) = 5 k/w. (3) r th(c-a) = 13 k/w.
2004 jan 28 7 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c thermal characteristics dc characteristics v p = 14.4 v; t amb =25 c; measured in circuit of fig.6; unless otherwise speci?ed. notes 1. the circuit is dc adjusted at v p = 6 to 17.5 v and ac operating at v p = 8.5 to 17.5 v. 2. at v p = 17.5 to 30 v, the dc output voltage is 0.5v p . symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient; tda1519c, tda1519cth and tda1519ctd in free air 40 k/w r th(j-c) thermal resistance from junction to case; tda1519c, tda1519cth and tda1519ctd 3 k/w symbol parameter conditions min. typ. max. unit supply v p supply voltage note 1 6.0 14.4 17.5 v i q(tot) total quiescent current - 40 80 ma v o dc output voltage note 2 - 6.95 - v ?d v oo ? dc output offset voltage -- 250 mv mute/standby switch v sw(on) switch-on voltage level 8.5 -- v v mute mute voltage level 3.3 - 6.4 v v stb standby voltage level 0 - 2v mute/standby condition v o output voltage mute mode; v i = 1 v (maximum); f i =20hzto15khz -- 20 mv ?d v oo ? dc output offset voltage mute mode -- 250 mv i stb standby current standby mode -- 100 m a i sw(on) switch-on current - 12 40 m a
2004 jan 28 8 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c ac characteristics v p = 14.4 v; r l =4 w ; f = 1 khz; t amb =25 c; unless otherwise speci?ed. symbol parameter conditions min. typ. max. unit stereo application (see fig.6) p o output power note 1 thd = 0.5 % 4 5 - w thd = 10 % 5.5 6.0 - w r l =2 w ; note 1 thd = 0.5 % 7.5 8.5 - w thd = 10 % 10 11 - w thd total harmonic distortion p o =1w - 0.1 - % f ro(l) low frequency roll-off - 3 db; note 2 - 45 - hz f ro(h) high frequency roll-off - 1db 20 -- khz g v(cl) closed-loop voltage gain 39 40 41 db svrr supply voltage ripple rejection on; notes 3 and 4 40 -- db on; notes 3 and 5 45 -- db mute; notes 3 and 6 45 -- db standby; notes 3 and 6 80 -- db ? z i ? input impedance 50 60 75 k w v n(o)(rms) noise output voltage (rms value) note 7 on; r s =0 w- 150 -m v on; r s =10k w- 250 500 m v mute; note 8 - 120 -m v a cs channel separation r s =10k w 40 -- db ?d g v(ub) ? channel unbalance - 0.1 1 db btl application (see fig.7) p o output power note 1 thd = 0.5 % 15 17 - w thd = 10 % 20 22 - w v p = 13.2 v; note 1 thd = 0.5 % - 13 - w thd=10% - 17.5 - w thd total harmonic distortion p o =1w - 0.1 - % b p power bandwidth thd = 0.5 %; p o = - 1 db; with respect to 15 w - 35 to 15000 - hz f ro(l) low frequency roll-off - 1 db; note 2 - 45 - hz f ro(h) high frequency roll-off - 1db 20 -- khz g v(cl) closed-loop voltage gain 45 46 47 db
2004 jan 28 9 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c notes 1. output power is measured directly at the output pins of the device. 2. frequency response externally fixed. 3. ripple rejection measured at the output with a source impedance of 0 w (maximum ripple amplitude of 2 v). 4. frequency f = 100 hz. 5. frequency between 1 and 10 khz. 6. frequency between 100 hz and 10 khz. 7. noise voltage measured in a bandwidth of 20 hz to 20 khz. 8. noise output voltage independent of r s (v i = 0 v). svrr supply voltage ripple rejection on; notes 3 and 4 34 -- db on; notes 3 and 5 48 -- db mute; notes 3 and 6 48 -- db standby; notes 3 and 6 80 -- db ? z i ? input impedance 25 30 38 k w v n(o)(rms) noise output voltage (rms value) note 7 on; r s =0 w- 200 -m v on; r s =10k w- 350 700 m v mute; note 8 - 180 -m v symbol parameter conditions min. typ. max. unit
2004 jan 28 10 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c application information fig.6 stereo application diagram (tda1519c). handbook, full pagewidth 2200 m f 1000 m f 100 m f 100 nf 220 nf 60 k w input reference voltage 40 db + - 1 220 nf 60 k w 40 db - + 9 546 inverting input non-inverting input internal 1/2 v p v p power ground 2 signal ground tda1519c 38 7 standby switch mgl493 fig.7 btl application diagram (tda1519c). handbook, full pagewidth 2200 m f 100 nf 220 nf 60 k w r l = 4 w input reference voltage 40 db + - 1 60 k w 40 db - + 9 546 non-inverting input to pin 9 internal 1/2 v p v p power ground 2 signal ground tda1519c 38 7 standby switch mgl494 to pin 1
2004 jan 28 11 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c fig.8 total quiescent current as a function of the supply voltage. handbook, halfpage 020 60 30 40 50 mgr539 4 8 12 16 i q(tot) (ma) v p (v) fig.9 output power as a function of the supply voltage. handbook, halfpage 020 30 0 10 20 mgr540 4 8 12 16 p o (w) v p (v) thd = 10% 0.5% btl application. r l =4 w . f i = 1 khz.
2004 jan 28 12 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c fig.10 total harmonic distortion as a function of the output power. handbook, halfpage 12 0 10 - 1 11010 2 mgr541 4 8 thd (%) p o (w) btl application. r l =4 w . f i = 1 khz. handbook, halfpage 0.6 0 10 10 2 10 3 10 4 mgu377 0.2 0.4 thd (%) f i (hz) fig.11 total harmonic distortion as a function of the operating frequency. btl application. r l =4 w . p o =1w.
2004 jan 28 13 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c package outlines unit a b max. b p 2 cd (1) e (1) z (1) de d h l j references outline version european projection issue date iec jedec jeita mm 4.6 4.4 1.1 0.75 0.60 0.48 0.38 24.0 23.6 20.0 19.6 10 2.54 12.2 11.8 3.4 3.1 a max. 1 2 e h 6 2.00 1.45 2.1 1.8 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 17.2 16.5 sot131-2 99-12-17 03-03-12 0 5 10 mm scale q 0.25 w 0.03 x d l a e c a 2 q w m b p d d z e x h 19 e h non-concave seating plane 1 b j sil9p: plastic single in-line power package; 9 leads sot131-2 view b : mounting base side b
2004 jan 28 14 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c unit a a 1 a 2 a 3 b p cd (1) e (1) z (1) de d h e h l p l references outline version european projection issue date iec jedec jeita mm 4.9 4.2 0.35 0.05 4.6 4.4 0.25 0.75 0.60 24.0 23.6 0.48 0.38 10 20.0 19.6 12.2 11.8 2.54 3.4 2.8 2.1 1.9 6 3 0 2.00 1.45 3.4 3.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. 7.4 6.6 sot354-1 0 5 10 mm scale q j 0.15 wx y q d c a 1 q heatsink heatsink q a l p (a 3 ) a 2 0.03 0.25 w m b p d d h z e x 91 j e h non-concave 99-12-17 03-03-12 sms9p: plastic surface mounted single in-line power package; 9 leads sot354-1 l e y
2004 jan 28 15 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c unit a 1 references outline version european projection issue date 03-02-18 03-07-23 iec jedec jeita mm 0.3 0.1 3.6 0.35 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot397-1 0 5 10 mm scale hsop20: plastic, heatsink small outline package; 20 leads sot397-1 a max. d y h e a 1 a 4 a 2 b p (a 3 ) e c v m a x a l p detail x q a q w m z d 1 d 2 e 2 e 1 e 1 10 20 11 pin 1 index a 2 3.3 3.0 a 4 0.1 0 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.5 1.4 2.5 2.0 v 0.25 w 0.25 yz 8 0 q 0.1 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1.27 d (1) 16.0 15.8 e (1) 11.1 10.9 0.53 0.40 a 3
2004 jan 28 16 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c unit a 4 (1) references outline version european projection issue date iec jedec jeita mm + 0.08 - 0.04 3.5 0.35 dimensions (mm are the original dimensions) notes 1. limits per individual lead. 2. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot418-3 0 5 10 mm scale hsop20: plastic, heatsink small outline package; 20 leads; low stand-off height sot418-3 a max. detail x a 2 3.5 3.2 d 2 1.1 0.9 h e 14.5 13.9 l p 1.1 0.8 q 1.7 1.5 2.5 2.0 v 0.25 w 0.25 yz 8 0 q 0.07 x 0.03 d 1 13.0 12.6 e 1 6.2 5.8 e 2 2.9 2.5 b p c 0.32 0.23 e 1.27 d (2) 16.0 15.8 e (2) 11.1 10.9 0.53 0.40 a 3 a 4 a 2 (a 3 ) l p q a q d y x h e e c v m a x a b p w m z d 1 d 2 e 2 e 1 e 20 11 1 10 pin 1 index 02-02-12 03-07-23
2004 jan 28 17 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c soldering introduction this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our data handbook ic26; integrated circuit packages (document order number 9398 652 90011). there is no soldering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. wave soldering can still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. through-hole mount packages s oldering by dipping or by solder wave typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. the total contact time of successive solder waves must not exceed 5 seconds. the device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (t stg(max) ). if the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. m anual soldering apply the soldering iron (24 v or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. if the temperature of the soldering iron bit is less than 300 c it may remain in contact for up to 10 seconds. if the bit temperature is between 300 and 400 c, contact may be up to 5 seconds. surface mount packages r eflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215 to 270 c depending on solder paste material. the top-surface temperature of the packages should preferably be kept: below 225 c (snpb process) or below 245 c (pb-free process) C for all the bga, htsson..t and ssop-t packages C for packages with a thickness 3 2.5 mm C for packages with a thickness < 2.5 mm and a volume 3 350 mm 3 so called thick/large packages. below 240 c (snpb process) or below 260 c (pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm 3 so called small/thin packages. moisture sensitivity precautions, as indicated on packing, must be respected at all times. w ave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specifically developed. if wave soldering is used the following conditions must be observed for optimal results: use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. for packages with leads on two sides and a pitch (e): C larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; C smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be
2004 jan 28 18 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 c or 265 c, depending on solder material applied, snpb or pb-free respectively. a mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. m anual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limited to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c. suitability of ic packages for wave, re?ow and dipping soldering methods notes 1. for more detailed information on the bga packages refer to the (lf)bga application note (an01026); order a copy from your philips semiconductors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the data handbook ic26; integrated circuit packages; section: packing methods . 3. for sdip packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 4. hot bar soldering or manual soldering is suitable for pmfp packages. 5. these transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 c 10 c measured in the atmosphere of the reflow oven. the package body peak temperature must be kept as low as possible. 6. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 7. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. mounting package (1) soldering method wave reflow (2) dipping through-hole mount cpga, hcpga suitable - suitable dbs, dip, hdip, rdbs, sdip, sil suitable (3) -- through-hole- surface mount pmfp (4) not suitable not suitable - surface mount bga, htsson..t (5) , lbga, lfbga, sqfp, ssop-t (5) , tfbga, uson, vfbga not suitable suitable - dhvqfn, hbcc, hbga, hlqfp, hso, hsop, hsqfp, hsson, htqfp, htssop, hvqfn, hvson, sms not suitable (6) suitable - plcc (7) , so, soj suitable suitable - lqfp, qfp, tqfp not recommended (7)(8) suitable - ssop, tssop, vso, vssop not recommended (9) suitable - cwqccn..l (11) , pmfp (10) , wqccn32l (11) not suitable not suitable -
2004 jan 28 19 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c 8. wave soldering is suitable for lqfp, qfp and tqfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 9. wave soldering is suitable for ssop, tssop, vso and vssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 10. hot bar or manual soldering is suitable for pmfp packages. 11. image sensor packages in principle should not be soldered. they are mounted in sockets or delivered pre-mounted on flex foil. however, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. the appropriate soldering profile can be provided on request.
2004 jan 28 20 philips semiconductors product speci?cation 22 w btl or 2 11 w stereo power ampli?er tda1519c data sheet status notes 1. please consult the most recently issued data sheet before initiating or completing a design. 2. the product status of the device(s) described in this data sheet may have changed since this data sheet was published. the latest information is available on the internet at url http://www.semiconductors.philips.com. 3. for data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. level data sheet status (1) product status (2)(3) definition i objective data development this data sheet contains data from the objective speci?cation for product development. philips semiconductors reserves the right to change the speci?cation in any manner without notice. ii preliminary data quali?cation this data sheet contains data from the preliminary speci?cation. supplementary data will be published at a later date. philips semiconductors reserves the right to change the speci?cation without notice, in order to improve the design and supply the best possible product. iii product data production this data sheet contains data from the product speci?cation. philips semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. relevant changes will be communicated via a customer product/process change noti?cation (cpcn). definitions short-form specification ? the data in a short-form specification is extracted from a full data sheet with the same type number and title. for detailed information see the relevant data sheet or data handbook. limiting values definition ? limiting values given are in accordance with the absolute maximum rating system (iec 60134). stress above one or more of the limiting values may cause permanent damage to the device. these are stress ratings only and operation of the device at these or at any other conditions above those given in the characteristics sections of the specification is not implied. exposure to limiting values for extended periods may affect device reliability. application information ? applications that are described herein for any of these products are for illustrative purposes only. philips semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. disclaimers life support applications ? these products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. philips semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify philips semiconductors for any damages resulting from such application. right to make changes ? philips semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. when the product is in full production (status production), relevant changes will be communicated via a customer product/process change notification (cpcn). philips semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
? koninklijke philips electronics n.v. 2004 sca76 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. no liability will be accepted by the publisher for any consequence of its use. publication thereof does not con vey nor imply any license under patent- or other industrial or intellectual property rights. philips semiconductors C a worldwide company contact information for additional information please visit http://www.semiconductors.philips.com . fax: +31 40 27 24825 for sales of?ces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com . printed in the netherlands r32/04/pp 21 date of release: 2004 jan 28 document order number: 9397 750 12599

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